IoT-based temperature monitoring for buildings thermal comfort analysis

Estephany Paniagua, Jhonatan Macazana, Joshi Lopez, Jimmy Tarrillo

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

7 Citas (Scopus)

Resumen

In a building, unanticipated and abrupt temperature changes are mainly caused by the characteristics of its architecture: shape, size, number of windows, skylights, etc. This could cause discomfort or health issues to people exposed to its environment. For this reason, this paper presents the development and implementation of a remote temperature measurement system, which collects data inside a building and shows temperature information to any device connected to its local network. This system consists of 4 nodes, each built with an 8- bit microcontroller, a temperature sensor, and a radio frequency transceiver and a main node, based on a Raspberry.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9781728136462
DOI
EstadoPublicada - ago. 2019
Evento26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019 - Lima, Perú
Duración: 12 ago. 201914 ago. 2019

Serie de la publicación

NombreProceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019

Conferencia

Conferencia26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
País/TerritorioPerú
CiudadLima
Período12/08/1914/08/19

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