TY - GEN
T1 - IoT-based temperature monitoring for buildings thermal comfort analysis
AU - Paniagua, Estephany
AU - Macazana, Jhonatan
AU - Lopez, Joshi
AU - Tarrillo, Jimmy
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/8
Y1 - 2019/8
N2 - In a building, unanticipated and abrupt temperature changes are mainly caused by the characteristics of its architecture: shape, size, number of windows, skylights, etc. This could cause discomfort or health issues to people exposed to its environment. For this reason, this paper presents the development and implementation of a remote temperature measurement system, which collects data inside a building and shows temperature information to any device connected to its local network. This system consists of 4 nodes, each built with an 8- bit microcontroller, a temperature sensor, and a radio frequency transceiver and a main node, based on a Raspberry.
AB - In a building, unanticipated and abrupt temperature changes are mainly caused by the characteristics of its architecture: shape, size, number of windows, skylights, etc. This could cause discomfort or health issues to people exposed to its environment. For this reason, this paper presents the development and implementation of a remote temperature measurement system, which collects data inside a building and shows temperature information to any device connected to its local network. This system consists of 4 nodes, each built with an 8- bit microcontroller, a temperature sensor, and a radio frequency transceiver and a main node, based on a Raspberry.
KW - Embedded systems
KW - IoT
KW - Measurement nodes
KW - Thermal comfort
KW - Transceiver
UR - http://www.scopus.com/inward/record.url?scp=85073501495&partnerID=8YFLogxK
U2 - 10.1109/INTERCON.2019.8853608
DO - 10.1109/INTERCON.2019.8853608
M3 - Conference contribution
AN - SCOPUS:85073501495
T3 - Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
BT - Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
Y2 - 12 August 2019 through 14 August 2019
ER -