TY - GEN
T1 - Experimental Analysis of LoRa Propagation Models for IoT Applications in Lima, Peru
AU - Velizarof, Maria Jose Linares
AU - Nunez, Moises
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This paper presents an evaluation of a LoRa-based data transmission system deployed across urban, suburban, and outdoor areas in Lima, Peru. The study highlights signal reliability challenges, particularly in dense urban environments where high-rise buildings and infrastructure cause significant attenuation and interference. Results show robust performance in outdoor settings, while urban areas required further analysis to address signal loss. The research applies and adapts Okumura-Hata propagation models, proposing new equations tailored to Lima's specific geographic and structural conditions. These equations provide a more accurate prediction of signal behavior in urban environments, guiding strategies for optimizing LoRa networks. Future work will explore solutions such as increased node density and repeaters to improve coverage without extensive infrastructure modifications.
AB - This paper presents an evaluation of a LoRa-based data transmission system deployed across urban, suburban, and outdoor areas in Lima, Peru. The study highlights signal reliability challenges, particularly in dense urban environments where high-rise buildings and infrastructure cause significant attenuation and interference. Results show robust performance in outdoor settings, while urban areas required further analysis to address signal loss. The research applies and adapts Okumura-Hata propagation models, proposing new equations tailored to Lima's specific geographic and structural conditions. These equations provide a more accurate prediction of signal behavior in urban environments, guiding strategies for optimizing LoRa networks. Future work will explore solutions such as increased node density and repeaters to improve coverage without extensive infrastructure modifications.
UR - http://www.scopus.com/inward/record.url?scp=85217208752&partnerID=8YFLogxK
U2 - 10.1109/INTERCON63140.2024.10833473
DO - 10.1109/INTERCON63140.2024.10833473
M3 - Conference contribution
AN - SCOPUS:85217208752
T3 - Proceedings of the 2024 IEEE 31st International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2024
BT - Proceedings of the 2024 IEEE 31st International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2024
Y2 - 6 November 2024 through 8 November 2024
ER -