IoT-based temperature monitoring for buildings thermal comfort analysis

Estephany Paniagua; Jhonatan Macazana; Joshi Lopez; Jimmy Tarrillo

doi:10.1109/INTERCON.2019.8853608

IoT-based temperature monitoring for buildings thermal comfort analysis

Estephany Paniagua, Jhonatan Macazana, Joshi Lopez, Jimmy Tarrillo

Department of Electrical and Mechatronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

9 Scopus citations

Abstract

In a building, unanticipated and abrupt temperature changes are mainly caused by the characteristics of its architecture: shape, size, number of windows, skylights, etc. This could cause discomfort or health issues to people exposed to its environment. For this reason, this paper presents the development and implementation of a remote temperature measurement system, which collects data inside a building and shows temperature information to any device connected to its local network. This system consists of 4 nodes, each built with an 8- bit microcontroller, a temperature sensor, and a radio frequency transceiver and a main node, based on a Raspberry.

Original language	English
Title of host publication	Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728136462
DOIs	https://doi.org/10.1109/INTERCON.2019.8853608
State	Published - Aug 2019
Event	26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019 - Lima, Peru Duration: 12 Aug 2019 → 14 Aug 2019

Publication series

Name	Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019

Conference

Conference	26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019
Country/Territory	Peru
City	Lima
Period	12/08/19 → 14/08/19

Keywords

Embedded systems
IoT
Measurement nodes
Thermal comfort
Transceiver

Access to Document

10.1109/INTERCON.2019.8853608

Cite this

Paniagua, E., Macazana, J., Lopez, J., & Tarrillo, J. (2019). IoT-based temperature monitoring for buildings thermal comfort analysis. In Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019 Article 8853608 (Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INTERCON.2019.8853608

Paniagua, Estephany ; Macazana, Jhonatan ; Lopez, Joshi et al. / IoT-based temperature monitoring for buildings thermal comfort analysis. Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019).

@inproceedings{07f45bab3a4c49edb7b0f06ae38de7a6,

title = "IoT-based temperature monitoring for buildings thermal comfort analysis",

abstract = "In a building, unanticipated and abrupt temperature changes are mainly caused by the characteristics of its architecture: shape, size, number of windows, skylights, etc. This could cause discomfort or health issues to people exposed to its environment. For this reason, this paper presents the development and implementation of a remote temperature measurement system, which collects data inside a building and shows temperature information to any device connected to its local network. This system consists of 4 nodes, each built with an 8- bit microcontroller, a temperature sensor, and a radio frequency transceiver and a main node, based on a Raspberry.",

keywords = "Embedded systems, IoT, Measurement nodes, Thermal comfort, Transceiver",

author = "Estephany Paniagua and Jhonatan Macazana and Joshi Lopez and Jimmy Tarrillo",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019 ; Conference date: 12-08-2019 Through 14-08-2019",

year = "2019",

month = aug,

doi = "10.1109/INTERCON.2019.8853608",

language = "English",

series = "Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019",

}

Paniagua, E, Macazana, J, Lopez, J & Tarrillo, J 2019, IoT-based temperature monitoring for buildings thermal comfort analysis. in Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019., 8853608, Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019, Institute of Electrical and Electronics Engineers Inc., 26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019, Lima, Peru, 12/08/19. https://doi.org/10.1109/INTERCON.2019.8853608

IoT-based temperature monitoring for buildings thermal comfort analysis. / Paniagua, Estephany; Macazana, Jhonatan; Lopez, Joshi et al.
Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8853608 (Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - IoT-based temperature monitoring for buildings thermal comfort analysis

AU - Paniagua, Estephany

AU - Macazana, Jhonatan

AU - Lopez, Joshi

AU - Tarrillo, Jimmy

PY - 2019/8

Y1 - 2019/8

N2 - In a building, unanticipated and abrupt temperature changes are mainly caused by the characteristics of its architecture: shape, size, number of windows, skylights, etc. This could cause discomfort or health issues to people exposed to its environment. For this reason, this paper presents the development and implementation of a remote temperature measurement system, which collects data inside a building and shows temperature information to any device connected to its local network. This system consists of 4 nodes, each built with an 8- bit microcontroller, a temperature sensor, and a radio frequency transceiver and a main node, based on a Raspberry.

AB - In a building, unanticipated and abrupt temperature changes are mainly caused by the characteristics of its architecture: shape, size, number of windows, skylights, etc. This could cause discomfort or health issues to people exposed to its environment. For this reason, this paper presents the development and implementation of a remote temperature measurement system, which collects data inside a building and shows temperature information to any device connected to its local network. This system consists of 4 nodes, each built with an 8- bit microcontroller, a temperature sensor, and a radio frequency transceiver and a main node, based on a Raspberry.

KW - Embedded systems

KW - IoT

KW - Measurement nodes

KW - Thermal comfort

KW - Transceiver

UR - https://www.scopus.com/pages/publications/85073501495

U2 - 10.1109/INTERCON.2019.8853608

DO - 10.1109/INTERCON.2019.8853608

M3 - Conference contribution

AN - SCOPUS:85073501495

T3 - Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019

BT - Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 26th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019

Y2 - 12 August 2019 through 14 August 2019

ER -

Paniagua E, Macazana J, Lopez J, Tarrillo J. IoT-based temperature monitoring for buildings thermal comfort analysis. In Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8853608. (Proceedings of the 2019 IEEE 26th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2019). doi: 10.1109/INTERCON.2019.8853608

IoT-based temperature monitoring for buildings thermal comfort analysis

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