Effectiveness of BaTiO3 dielectric patches on YBa 2Cu3O7 thin films for MEM switches

J. Vargas, Y. Hijazi, J. Noel, Y. Vlasov, G. Larkins

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

A micro-electro-mechanical (MEM) switch built on a superconducting microstrip filter will be utilized to investigate BaTiO3 dielectric patches for functional switching points of contact. Actuation voltage resulting from the MEM switch provokes static friction between the bridge membrane and BaTiO3 insulation layer. The dielectric patch crystal structure and roughness affect the ability of repetitively switching cycles and lifetime. A series of experiments have been performed using different deposition methods and RF magnetron sputtering was found to be the best deposition process for the BaTiO3 layer. The effect examination of surface morphology will be presented using characterization techniques as x-ray diffraction, SEM and AFM for an optimum switching device. The thin film is made of YBa2Cu 3O7 deposited on LaAlO3 substrate by pulsed laser deposition. For this work, the dielectric material sputtering pressure is set at 9.5×10-6 Torr. The argon gas is released through a mass-flow controller to purge the system prior to deposition. RF power is 85 W at a distance of 9 cm. The behavior of Au membranes built on ultimate BaTiO 3 patches will be shown as part of the results. These novel surface patterns will in turn be used in modelling other RF MEM switch devices such as distributed-satellite communication system operating at cryogenic temperatures.

Original languageEnglish
Article number042045
JournalJournal of Physics: Conference Series
Volume507
Issue numberPART 4
DOIs
StatePublished - 2014
Event11th European Conference on Applied Superconductivity, EUCAS 2013 - Genoa, Italy
Duration: 15 Sep 201319 Sep 2013

Fingerprint

Dive into the research topics of 'Effectiveness of BaTiO3 dielectric patches on YBa 2Cu3O7 thin films for MEM switches'. Together they form a unique fingerprint.

Cite this